Single lead frame separating device

The invention discloses a single lead frame separating device, and relates to the technical field of integrated circuits. The problems that single power devices arranged in a lead frame after plastic packaging cannot be separated at will, products are arranged in a scattered mode after rib cutting f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: DU HONGWEI, DING QI, LIU XUCHANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a single lead frame separating device, and relates to the technical field of integrated circuits. The problems that single power devices arranged in a lead frame after plastic packaging cannot be separated at will, products are arranged in a scattered mode after rib cutting forming and separation are adopted, and sampling data are inaccurate are solved. Comprising a pressing handle which is arranged on the manual punching machine and enables the manual punching machine to move downwards in the vertical direction through the pressing handle; the upper surface of the upper die frame is used for arranging the manual punching machine, an upper die assembly is arranged on one side of the upper die frame, the upper die assembly comprises a male die, and the upper die frame drives the male die to move downwards in the vertical direction under the action of the pressing handle; the lower die holder is located under the upper die frame, a female die plate comprising a female die is arranged on