Freely configurable power semiconductor module
A power semiconductor module (10) comprises: at least one semiconductor plate (16) comprising at least two semiconductor chips (24), each semiconductor chip (24) having two power electrodes (26, 28); an adapter plate (14) attached to the semiconductor plate (16) over the at least two semiconductor c...
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| creator | KISIN SRDJAN SCHUDERER JURGEN MOHN FABIAN RIEDEL, G ¨ 1 NTER |
| description | A power semiconductor module (10) comprises: at least one semiconductor plate (16) comprising at least two semiconductor chips (24), each semiconductor chip (24) having two power electrodes (26, 28); an adapter plate (14) attached to the semiconductor plate (16) over the at least two semiconductor chips (24), the adapter plate (14) comprising, for each semiconductor chip (24), a terminal region (46) on a side facing away from the semiconductor plate (16); wherein the adapter plate (14) provides, in each terminal region (46), a power terminal (42) for each power electrode (26, 28) of the semiconductor chip (24) associated with the terminal region (46); wherein each power terminal (42) is electrically connected to the semiconductor chip (24) by conductive vertical posts (34, 36) below the terminal region (46).
一种功率半导体模块(10)包括：至少一个半导体板(16)，包括至少两个半导体芯片(24)，每个半导体芯片(24)具有两个功率电极(26，28)；适配器板(14)，在至少两个半导体芯片(24)上方附接至半导体板(16)，适配器板(14)在背离半导体板(16)的一侧上针对每个半导体芯片(24)包括端子区域(46)；其中，适配器板(14)在每个端子区域(46)中为与端子区域(46)相关的半导体芯片(24)的每个 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115039222A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115039222A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115039222A3</originalsourceid><addsrcrecordid>eNrjZNBzK0pNzalUSM7PS8tMLy1KTMpJVSjIL08tUihOzc0ECqeUJpfkFynk5qeU5qTyMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ1MDY0sjIyNHY2LUAAA2oisR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Freely configurable power semiconductor module</title><source>esp@cenet</source><creator>KISIN SRDJAN ; SCHUDERER JURGEN ; MOHN FABIAN ; RIEDEL, G ¨ 1 NTER</creator><creatorcontrib>KISIN SRDJAN ; SCHUDERER JURGEN ; MOHN FABIAN ; RIEDEL, G ¨ 1 NTER</creatorcontrib><description>A power semiconductor module (10) comprises: at least one semiconductor plate (16) comprising at least two semiconductor chips (24), each semiconductor chip (24) having two power electrodes (26, 28); an adapter plate (14) attached to the semiconductor plate (16) over the at least two semiconductor chips (24), the adapter plate (14) comprising, for each semiconductor chip (24), a terminal region (46) on a side facing away from the semiconductor plate (16); wherein the adapter plate (14) provides, in each terminal region (46), a power terminal (42) for each power electrode (26, 28) of the semiconductor chip (24) associated with the terminal region (46); wherein each power terminal (42) is electrically connected to the semiconductor chip (24) by conductive vertical posts (34, 36) below the terminal region (46).
一种功率半导体模块(10)包括：至少一个半导体板(16)，包括至少两个半导体芯片(24)，每个半导体芯片(24)具有两个功率电极(26，28)；适配器板(14)，在至少两个半导体芯片(24)上方附接至半导体板(16)，适配器板(14)在背离半导体板(16)的一侧上针对每个半导体芯片(24)包括端子区域(46)；其中，适配器板(14)在每个端子区域(46)中为与端子区域(46)相关的半导体芯片(24)的每个</description><language>chi ; eng</language><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONTROL OR REGULATION THEREOF ; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220909&DB=EPODOC&CC=CN&NR=115039222A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220909&DB=EPODOC&CC=CN&NR=115039222A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KISIN SRDJAN</creatorcontrib><creatorcontrib>SCHUDERER JURGEN</creatorcontrib><creatorcontrib>MOHN FABIAN</creatorcontrib><creatorcontrib>RIEDEL, G ¨ 1 NTER</creatorcontrib><title>Freely configurable power semiconductor module</title><description>A power semiconductor module (10) comprises: at least one semiconductor plate (16) comprising at least two semiconductor chips (24), each semiconductor chip (24) having two power electrodes (26, 28); an adapter plate (14) attached to the semiconductor plate (16) over the at least two semiconductor chips (24), the adapter plate (14) comprising, for each semiconductor chip (24), a terminal region (46) on a side facing away from the semiconductor plate (16); wherein the adapter plate (14) provides, in each terminal region (46), a power terminal (42) for each power electrode (26, 28) of the semiconductor chip (24) associated with the terminal region (46); wherein each power terminal (42) is electrically connected to the semiconductor chip (24) by conductive vertical posts (34, 36) below the terminal region (46).
一种功率半导体模块(10)包括：至少一个半导体板(16)，包括至少两个半导体芯片(24)，每个半导体芯片(24)具有两个功率电极(26，28)；适配器板(14)，在至少两个半导体芯片(24)上方附接至半导体板(16)，适配器板(14)在背离半导体板(16)的一侧上针对每个半导体芯片(24)包括端子区域(46)；其中，适配器板(14)在每个端子区域(46)中为与端子区域(46)相关的半导体芯片(24)的每个</description><subject>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONTROL OR REGULATION THEREOF</subject><subject>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBzK0pNzalUSM7PS8tMLy1KTMpJVSjIL08tUihOzc0ECqeUJpfkFynk5qeU5qTyMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DQ1MDY0sjIyNHY2LUAAA2oisR</recordid><startdate>20220909</startdate><enddate>20220909</enddate><creator>KISIN SRDJAN</creator><creator>SCHUDERER JURGEN</creator><creator>MOHN FABIAN</creator><creator>RIEDEL, G ¨ 1 NTER</creator><scope>EVB</scope></search><sort><creationdate>20220909</creationdate><title>Freely configurable power semiconductor module</title><author>KISIN SRDJAN ; SCHUDERER JURGEN ; MOHN FABIAN ; RIEDEL, G ¨ 1 NTER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115039222A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONTROL OR REGULATION THEREOF</topic><topic>CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KISIN SRDJAN</creatorcontrib><creatorcontrib>SCHUDERER JURGEN</creatorcontrib><creatorcontrib>MOHN FABIAN</creatorcontrib><creatorcontrib>RIEDEL, G ¨ 1 NTER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KISIN SRDJAN</au><au>SCHUDERER JURGEN</au><au>MOHN FABIAN</au><au>RIEDEL, G ¨ 1 NTER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Freely configurable power semiconductor module</title><date>2022-09-09</date><risdate>2022</risdate><abstract>A power semiconductor module (10) comprises: at least one semiconductor plate (16) comprising at least two semiconductor chips (24), each semiconductor chip (24) having two power electrodes (26, 28); an adapter plate (14) attached to the semiconductor plate (16) over the at least two semiconductor chips (24), the adapter plate (14) comprising, for each semiconductor chip (24), a terminal region (46) on a side facing away from the semiconductor plate (16); wherein the adapter plate (14) provides, in each terminal region (46), a power terminal (42) for each power electrode (26, 28) of the semiconductor chip (24) associated with the terminal region (46); wherein each power terminal (42) is electrically connected to the semiconductor chip (24) by conductive vertical posts (34, 36) below the terminal region (46).
一种功率半导体模块(10)包括：至少一个半导体板(16)，包括至少两个半导体芯片(24)，每个半导体芯片(24)具有两个功率电极(26，28)；适配器板(14)，在至少两个半导体芯片(24)上方附接至半导体板(16)，适配器板(14)在背离半导体板(16)的一侧上针对每个半导体芯片(24)包括端子区域(46)；其中，适配器板(14)在每个端子区域(46)中为与端子区域(46)相关的半导体芯片(24)的每个</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Freely configurable power semiconductor module |
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