Freely configurable power semiconductor module

A power semiconductor module (10) comprises: at least one semiconductor plate (16) comprising at least two semiconductor chips (24), each semiconductor chip (24) having two power electrodes (26, 28); an adapter plate (14) attached to the semiconductor plate (16) over the at least two semiconductor chips (24), the adapter plate (14) comprising, for each semiconductor chip (24), a terminal region (46) on a side facing away from the semiconductor plate (16); wherein the adapter plate (14) provides, in each terminal region (46), a power terminal (42) for each power electrode (26, 28) of the semiconductor chip (24) associated with the terminal region (46); wherein each power terminal (42) is electrically connected to the semiconductor chip (24) by conductive vertical posts (34, 36) below the terminal region (46). 一种功率半导体模块(10)包括：至少一个半导体板(16)，包括至少两个半导体芯片(24)，每个半导体芯片(24)具有两个功率电极(26，28)；适配器板(14)，在至少两个半导体芯片(24)上方附接至半导体板(16)，适配器板(14)在背离半导体板(16)的一侧上针对每个半导体芯片(24)包括端子区域(46)；其中，适配器板(14)在每个端子区域(46)中为与端子区域(46)相关的半导体芯片(24)的每个