Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board

Provided is a roughened copper foil which can achieve both excellent etching properties and high shear strength in the processing of a copper-clad laminate and/or in the production of a printed wiring board. The roughened copper foil has a roughened surface on at least one side. The roughened surface has an interface expansion area ratio (Sdr) of 3.50% to 12.00% (inclusive) as measured in accordance with ISO 25178 under the conditions that the cut-off wavelength by an S filter is 0.55 [mu] m and the cut-off wavelength by an L filter is 10 [mu] m. The roughened copper foil has a central portion level difference Sk of 0.15 [mu] m or more and 0.35 [mu] m or less as measured in accordance with ISO 25178 under the conditions that a cutoff wavelength by an S filter is 0.55 [mu] m and a cutoff wavelength by an L filter is 10 [mu] m. 提供在覆铜层叠板的加工和/或印刷电路板的制造中能兼顾优异的蚀刻性和高的抗剪强度的粗糙化处理铜箔。该粗糙化处理铜箔在至少一侧具有粗糙化处理面。粗糙化处理面的依据ISO25178在基于S滤波器的截止波长为0.55μm以及基于L滤波器的截止波长为10μm的条件下测定的界面扩展面积比Sdr为3.50％以上且12.00％以下。该粗糙化处理铜箔的依据ISO25178在基于S滤波器的