Multi-layer circuit board capable of preventing layer deviation and manufacturing method thereof

The invention discloses an anti-layer-deviation multilayer circuit board and a manufacturing method thereof, the anti-layer-deviation multilayer circuit board comprises an inner core layer, the inner core layer comprises two metal substrates, the two metal substrates are symmetrically distributed up and down, an adhesion layer is arranged between the two metal substrates, and the adhesion layer is arranged between the two metal substrates. One ends, far away from each other, of the two metal substrates are provided with accommodating cavities, the accommodating cavities are of rectangular structures, prepregs are arranged in the two accommodating cavities, and one ends, far away from each other, of the two prepregs are provided with circuit layers. The containing cavity is formed in the outer surface of the metal base plate and used for containing the semi-solid pieces, the flowing range of the semi-solid pieces is limited, the probability of sliding plate between layers caused by disordered flowing of the se