Array substrate and preparation method thereof, lamp panel assembly and backlight module
The embodiment of the invention provides an array substrate, a preparation method of the array substrate, a lamp panel assembly, a preparation method of the lamp panel assembly and a backlight module. The array substrate comprises a base material, a solder mask structure arranged on one side of the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention provides an array substrate, a preparation method of the array substrate, a lamp panel assembly, a preparation method of the lamp panel assembly and a backlight module. The array substrate comprises a base material, a solder mask structure arranged on one side of the base material, a plurality of filling structures and a plurality of conductive units arranged in an array mode. Each conductive unit comprises two bonding pads; each filling structure covers the base material between the two bonding pads of each conductive unit; the solder mask structure is provided with a plurality of through holes arranged in an array, and each conductive unit and each filling structure are located in each through hole; the side, away from the base material, of the bonding pad is used for being connected with the curable conductive structure, and the thickness of the filling structure is smaller than the minimum distance between the first surface, away from the base material, of the solder mask s |
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