Integrated circuit wafer surface defect detection method based on artificial intelligence

The invention discloses an integrated circuit wafer surface defect detection method based on artificial intelligence, and relates to the field of defect detection. Comprising the steps of obtaining a to-be-detected wafer surface image; encoding the gradient change quantity of the pixel points to obtain gradient change chain codes of the surface image of the wafer to be detected and the surface image of the standard wafer; calculating gradient similarity to carry out region division on the surface image of the wafer to be detected; calculating a pixel characteristic value of each pixel point; calculating the suspected defect degree of each region according to the frequency of each characteristic value; dividing the feature histogram according to the suspected defect degree; and obtaining a surface enhanced image of the to-be-detected wafer, and performing edge detection to obtain a defect area of the to-be-detected wafer. According to the method, the gradient change of the pixel points of the to-be-detected wa