Method for recovering silver from waste circuit board solder

The invention discloses a method for recovering silver from a waste circuit board solder, which comprises the following steps: placing the waste circuit board solder in a vacuum furnace, and carrying out vacuum gasification to obtain crude lead and a tin-silver alloy I; putting the obtained tin-silver alloy I into a crystallizer for continuous crystallization to obtain crude tin I and tin-silver alloy II; carrying out vacuum gasification-fractional condensation on the obtained tin-silver alloy II to obtain crude silver and crude tin II; and the obtained crude tin II and the welding flux needing to be recycled are put into the vacuum furnace together, the first step is executed, and the steps are repeated. The method is environment-friendly, economical and efficient in recovery of silver in the waste circuit board solder, is simple and easy to operate, and has a wide industrial application prospect. 本发明公开了一种从废旧线路板焊料中回收银的方法，包括如下步骤：将废旧线路板焊料置于真空炉中，真空气化得到粗铅和锡银合金Ⅰ；将得到的锡银合金Ⅰ放入结晶机连续结晶得到粗锡Ⅰ及锡银合金Ⅱ；将得到的锡银合金Ⅱ经过真空气化-分级冷凝得