Thermally conductive composite material

提供一种热导率高于22W/m°K的导热成型组合物(100)。导热组合物(100)包含30-60体积％的聚合物基体(12)。在该组合物中含有25-60体积％的第一种导热填料(116)，该填料具有至少为10∶1的较高长宽比。在该组合物混合物(100)中也含有10-25体积％的第二种导热填料(114)，该填料具有5∶1或更小的较低长宽比。 A conductive molding composition, with a thermal conductivity above 22 W/m DEG K., is provided. The thermally conductive composition...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	K.A. MCCULLOUGH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!