Thermally conductive composite material

提供一种热导率高于22W/m°K的导热成型组合物(100)。导热组合物(100)包含30-60体积％的聚合物基体(12)。在该组合物中含有25-60体积％的第一种导热填料(116)，该填料具有至少为10∶1的较高长宽比。在该组合物混合物(100)中也含有10-25体积％的第二种导热填料(114)，该填料具有5∶1或更小的较低长宽比。 A conductive molding composition, with a thermal conductivity above 22 W/m DEG K., is provided. The thermally conductive composition...

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Bibliographische Detailangaben
1. Verfasser:	K.A. MCCULLOUGH
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	提供一种热导率高于22W/m°K的导热成型组合物(100)。导热组合物(100)包含30-60体积％的聚合物基体(12)。在该组合物中含有25-60体积％的第一种导热填料(116)，该填料具有至少为10∶1的较高长宽比。在该组合物混合物(100)中也含有10-25体积％的第二种导热填料(114)，该填料具有5∶1或更小的较低长宽比。 A conductive molding composition, with a thermal conductivity above 22 W/m DEG K., is provided. The thermally conductive composition includes a polymer base matrix of, by volume, between 30 and 60 percent. A first thermally conductive filler, by volume, between 25 and 60 percent is provided in the composition that has a relatively high aspect ratio of at least 10:1. Also in the composition mixture is a second thermally conductive filler, by volume, between 10 and 25 percent that has a relatively low aspect ratio of 5:1 or less.