Silica particles, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor device

The present invention addresses the problem of providing: silica particles which suppress secondary aggregation, have excellent dispersion stability, and are suitable for polishing; a silica sol containing the silica particles; and a polishing composition containing the silica sol. The present invention relates to silica particles in which the average value of circularity coefficients measured by a field emission scanning electron microscope is 0.90 or more and the standard deviation of the circularity coefficients is 0.05 or less. 本发明的课题在于提供一种抑制二次凝聚、分散稳定性优异、且适于研磨的二氧化硅粒子、含有该二氧化硅粒子的硅溶胶以及含有该硅溶胶的研磨组合物。本发明涉及一种二氧化硅粒子，通过场发射型扫描电子显微镜测定的圆形度系数的平均值为0.90以上，且上述圆形度系数的标准偏差为0.05以下。