High-purity copper lead used on semiconductor and processing technology of high-purity copper lead

The invention relates to the technical field of copper wires, and provides a high-purity copper lead used on a semiconductor and a processing technology thereof, and the technical key points are as follows: the high-purity copper lead used on the semiconductor comprises a gold core wire, and a high-purity copper layer with the grade of more than 6N is sputtered on the surface of the gold core wire; the inner diameter of the high-purity copper layer is at least three times that of the gold core wire. The invention further provides a processing technology of the high-purity copper lead used on the semiconductor. The processing technology comprises the following steps that S1, high-purity copper is electrolyzed; s2, performing electrolytic refining on ultrahigh-purity copper; s3, smelting is conducted; and S4, carrying out vacuum magnetic sputtering. The high-purity copper lead used on the semiconductor has high electrical conductivity and thermal conductivity, has good strength and hardness, has the advantages