Magnetic field curable epoxy resin binding material and preparation method thereof

The invention relates to an epoxy resin binding material capable of being cured by a magnetic field. The epoxy resin binding material is prepared from the following raw materials in parts by mass: 30-35 parts of epoxy resin, 10-25 parts of a toughening agent, 7-10 parts of metal nanoparticles, 0.4-0.6 part of black pigment, 30-35 parts of filler and 8-10 parts of a curing agent. The prepared epoxy resin bonding material has the advantages of being capable of being cured in a magnetic field, high in curing speed, good in bonding force, good in electrical insulation performance and the like, is suitable for bonding and fixing of various thermosensitive materials and light-proof materials, and effectively improves the practicability and reliability of miniature electronic products. 本发明涉及一种可磁场固化环氧树脂粘结材料，由以下质量份数的各原料组成：环氧树脂30～35份、增韧剂10～25份、金属纳米粒子7～10份、黑色颜料0.4～0.6份、填料30～35份、固化剂8～10份。本发明制备的环氧树脂粘结材料具有可磁场固化、固化速度快、粘结力好、电绝缘性能好等优点，适用于各种热敏型材料和不透光材料的粘结和固定，有效的增加了微型电子产品的实用性和可靠性。