Two-component polishing solution, preparation method thereof and silicon wafer polishing method

The invention provides a two-component polishing solution, a preparation method thereof and a silicon wafer polishing method. The double-component polishing solution provided by the invention comprises a component A and a component B, wherein the component A is prepared from the following components in parts by mass: 1 to 100 parts of FeSO4; 1000 parts of water; the dosage of the acidic pH regulator is used for enabling the pH value of the component A to reach 2-6; the component B is prepared from the following components in parts by mass: 70 to 120 parts of grinding particles; 20 to 200 parts of persulfate; 2-20 parts of a chelating agent; 1000 parts of water; and the dosage of the acidic pH regulator is used for enabling the pH value of the component B to reach 2-6. The double-component polishing solution provided by the invention not only can realize high-efficiency and high-quality processing of the surface of a silicon wafer, but also is non-toxic, harmless, safe and environment-friendly, and can improve