Method for intensively repairing toxic and harmful refractory organic pollutants in wetland through photocatalysis of copper slag
The invention discloses a method for intensively repairing toxic and harmful degradation-resistant organic pollutants in a wetland by utilizing photocatalysis of copper slag, which comprises the following steps: activating the copper slag (crushing and grinding, calcining, adding acid for reaction,...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for intensively repairing toxic and harmful degradation-resistant organic pollutants in a wetland by utilizing photocatalysis of copper slag, which comprises the following steps: activating the copper slag (crushing and grinding, calcining, adding acid for reaction, and drying to excite the activity of metal elements in the copper slag), paving the activated copper slag on the surface layer of the wetland to be repaired, and carrying out photocatalytic treatment on the surface layer of the wetland to be repaired. The concentration ratio of metal ions in the copper slag to dissolved organic matters (DOM) in the wetland polluted water body is regulated and controlled, so that DOM in the polluted water body and the metal ions in the copper slag are fully complexed to form a DOM-metal complex, and the DOM-metal complex is subjected to photoinduced electron transfer to generate hydroxyl radicals under the condition of sunlight illumination; therefore, degradation of refractory orga |
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