Ejecting head chip for fluid ejecting head and method for reducing width of silicon shelf

An injector head chip (52) for a fluid injection device and a method for reducing a silicon shelf width (W2) between a fluid supply through-hole (14) and a fluid injector stack (50). The injector head chip (52) comprises a silicon substrate (24) and a fluid injector stack (50) deposited on the silicon substrate (24), wherein at least one metal layer (60) of the fluid injector stack (50) is isolated by an encapsulation material from fluid supply vias (14) etched in the injector head chip (52) sheet. 一种用于流体喷射装置的喷射头芯片(52)以及一种用于减小流体供应通孔(14)与流体喷射器堆叠(50)之间的硅搁架宽度(W2)的方法。喷射头芯片(52)包括硅衬底(24)及沉积在硅衬底(24)上的流体喷射器堆叠(50)，其中流体喷射器堆叠(50)的至少一个金属层(60)通过包封材料而与刻蚀在喷射头芯(52)片中的流体供应通孔(14)隔离。