Coil device and manufacturing method
Provided is a novel coil device. The coil device includes: a support body; an insulating bonding layer provided on the support body; and a conductive coil, a part of which enters the bonding layer. 提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。...
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| creator | TANAKA SHINYA TANEKO NORIAKI TAKII SHUKICHI TAKANAMI KAZUO |
| description | Provided is a novel coil device. The coil device includes: a support body; an insulating bonding layer provided on the support body; and a conductive coil, a part of which enters the bonding layer.
提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。 |
| format | Patent |
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提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220902&DB=EPODOC&CC=CN&NR=114999764A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220902&DB=EPODOC&CC=CN&NR=114999764A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANAKA SHINYA</creatorcontrib><creatorcontrib>TANEKO NORIAKI</creatorcontrib><creatorcontrib>TAKII SHUKICHI</creatorcontrib><creatorcontrib>TAKANAMI KAZUO</creatorcontrib><title>Coil device and manufacturing method</title><description>Provided is a novel coil device. The coil device includes: a support body; an insulating bonding layer provided on the support body; and a conductive coil, a part of which enters the bonding layer.
提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBxzs_MUUhJLctMTlVIzEtRyE3MK01LTC4pLcrMS1fITS3JyE_hYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhiaWlpbmZiaOxsSoAQABICbO</recordid><startdate>20220902</startdate><enddate>20220902</enddate><creator>TANAKA SHINYA</creator><creator>TANEKO NORIAKI</creator><creator>TAKII SHUKICHI</creator><creator>TAKANAMI KAZUO</creator><scope>EVB</scope></search><sort><creationdate>20220902</creationdate><title>Coil device and manufacturing method</title><author>TANAKA SHINYA ; TANEKO NORIAKI ; TAKII SHUKICHI ; TAKANAMI KAZUO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN114999764A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA SHINYA</creatorcontrib><creatorcontrib>TANEKO NORIAKI</creatorcontrib><creatorcontrib>TAKII SHUKICHI</creatorcontrib><creatorcontrib>TAKANAMI KAZUO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA SHINYA</au><au>TANEKO NORIAKI</au><au>TAKII SHUKICHI</au><au>TAKANAMI KAZUO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Coil device and manufacturing method</title><date>2022-09-02</date><risdate>2022</risdate><abstract>Provided is a novel coil device. The coil device includes: a support body; an insulating bonding layer provided on the support body; and a conductive coil, a part of which enters the bonding layer.
提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS |
| title | Coil device and manufacturing method |
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