Coil device and manufacturing method

Coil device and manufacturing method

Provided is a novel coil device. The coil device includes: a support body; an insulating bonding layer provided on the support body; and a conductive coil, a part of which enters the bonding layer. 提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TANAKA SHINYA, TANEKO NORIAKI, TAKII SHUKICHI, TAKANAMI KAZUO
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Provided is a novel coil device. The coil device includes: a support body; an insulating bonding layer provided on the support body; and a conductive coil, a part of which enters the bonding layer. 提供一种新型的线圈装置。线圈装置包括：支撑体；绝缘性的接合层，设置在所述支撑体上；以及导电性线圈，所述导电性线圈的一部分进入所述接合层。