System-in-package and electronic device

The invention discloses system-in-package and electronic equipment, which can improve the electrical performance of a high-power device and reduce the manufacturing cost of the system-in-package on the basis of ensuring the effective heat dissipation of the high-power device in the system-in-package. The system-in-package comprises a substrate (1), a heat dissipation device (5), a first electronic device (3) and a second electronic device (4), the heat dissipation device (5), the first electronic device (3) and the second electronic device (4) are plastically packaged in the molding compound (2); the first electronic device (3) and the second electronic device (4) are arranged on one side of the substrate (1) and are connected with the substrate (1); the heat dissipation device (5) comprises a heat dissipation block (50) and a heat dissipation extension part (51) extending from the side surface of the heat dissipation block (50); and the heat dissipation block (50) is adhered to the surface of one side, far a