Method for manufacturing circuit board circuit structure with via holes and manufactured circuit board circuit structure with via holes

A manufacturing method of a circuit board circuit structure with via holes and the manufactured circuit board circuit structure with via holes, the manufacturing method of the circuit board circuit structure with via holes includes providing a substrate, the substrate including a base material layer, two copper layers and at least one hole, the two copper layers being respectively formed on a first surface and a second surface opposite to the base material layer, and the at least one hole being formed on the first surface and the second surface of the base material layer; the two copper layers are provided with first circuit pattern structures, at least one hole is conducted from the first surface side to the second surface of the base material layer, and the substrate further comprises two second photoresist layers on the copper layers to form pattern structures; forming a metallization layer through a chemical mode, and covering the surface of the hole and the surfaces of the second photoresist layers on th