Preparation method of micro light-emitting diode display device and electronic equipment
The invention provides a preparation method of a micro light-emitting diode display device and electronic equipment. The method comprises the following steps: providing a semiconductor substrate; forming a plurality of first driving wafers and a plurality of second driving wafers on the semiconducto...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a preparation method of a micro light-emitting diode display device and electronic equipment. The method comprises the following steps: providing a semiconductor substrate; forming a plurality of first driving wafers and a plurality of second driving wafers on the semiconductor substrate, wherein each of the first driving wafers and the second driving wafers comprises a driving circuit for driving the micro light emitting diode chips; forming interconnection line layers on the plurality of first driving wafers and the plurality of second driving wafers; forming a plurality of first micro light-emitting diode chip bonding pads and a plurality of second micro light-emitting diode chip bonding pads on the interconnection line layer; a flip micro light-emitting diode chip is formed on each first micro light-emitting diode chip bonding pad and a second micro light-emitting diode chip bonding pad which are adjacent to each other, and each micro light-emitting diode chip is in signal connectio |
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