Quad flat no-lead (QFN) manufacturing process

The invention relates to a quad flat no-lead (QFN) manufacturing process. A lead frame (100) includes a metal structure having opposing first and second sides (111, 112) and a respective device portion (101) having a lead (102) having first and second lateral sides (131, 132) extending from a tie bar (103) toward a die attach pad (104). One or more of the leads (102) includes a first indentation (121) extending in the first lateral side (131) to a first side (111) of the metal structure and a second indentation (122) extending to a second side (111) of the metal to reduce saw blade load and mitigate saw burrs and lead trailing during package singulation. A packaged electronic device includes a package structure, a semiconductor die encapsulated by the package structure, and leads (102) having a first side (111), a second side (112), and first and second lateral sides (131, 132), wherein the leads include a first indentation (121) extending in the first lateral side (131) to the first side (111) and a second i