Structures with controlled polyimide profiles and methods of forming same
The present disclosure describes a structure having a controlled polyimide profile and a method of forming such a structure. The method comprises the following steps: depositing a photoresist containing polyimide on a substrate; and performing a first annealing at the first temperature. The method f...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present disclosure describes a structure having a controlled polyimide profile and a method of forming such a structure. The method comprises the following steps: depositing a photoresist containing polyimide on a substrate; and performing a first annealing at the first temperature. The method further includes exposing the photoresist to a radiation source through a light mask having a pattern associated with the shape of the polyimide opening. The method further includes performing a second annealing at a second temperature; and removing part of the photoresist to form a polyimide opening. The method further comprises the steps of: performing a third annealing at a third temperature; and cleaning the polyimide opening by ashing.
本揭示案描述一种具有受控聚酰亚胺轮廓的结构及一种形成此种结构的方法。此方法包括以下步骤:在基板上沉积含有聚酰亚胺的光阻剂;及在第一温度下执行第一退火。方法进一步包括以下步骤:透过一光遮罩将此光阻剂曝光于辐射源,此光遮罩具有与聚酰亚胺开口形状关联的图案。此方法进一步包括以下步骤:在第二温度下执行第二退火;及去除部分光阻剂以形成聚酰亚胺开口。此方法进一步包括以下步骤:在第三温度下执行第三退火;及通过灰化清理聚酰亚胺开口。 |
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