Wafer-level packaging structure of accelerometer

The invention provides a wafer-level packaging structure of an accelerometer, and relates to the technical field of accelerometer packaging, and the wafer-level packaging structure comprises a bottom shell, the upper end of the bottom shell is provided with an accelerometer, the upper end of the bottom shell is provided with a top shell, the lower end of the top shell is fixedly provided with a heat conduction pipe, and the lower end of the heat conduction pipe is fixedly connected with a heat conduction plate. A heat conduction silica gel sheet is fixedly installed at the lower end of the heat conduction plate, grooves are formed in the surfaces of the two sides of the bottom shell, and long grooves are formed in the surfaces of the heat conduction pipes. The bottom shell, the accelerometer, the top shell, the heat conduction pipes, the heat conduction plate, the heat conduction silica gel sheet, the grooves, the long grooves, reinforcing ribs, an interface shell and fixing holes are arranged; when the packa