Oxidation-corrosion-resistant electroplated copper lead for semiconductor and processing technology of oxidation-corrosion-resistant electroplated copper lead

The invention relates to the technical field of copper wires, and provides an anti-oxidation-corrosion electro-coppering lead for a semiconductor and a processing technology of the anti-oxidation-corrosion electro-coppering lead for the semiconductor, and the technical key points are that the anti-oxidation-corrosion electro-coppering lead for the semiconductor comprises a conductive lead and a plating layer, the conductive lead comprises a copper lead product manufactured by the following components in percentage by mass: 2%-3% of Sn, 0.1%-0.25% of P, 0.05%-0.1% of Zn and the balance of Cu. The plating layer is pure gold; the oxidation-corrosion-resistant electroplated copper lead for the semiconductor has high electrical conductivity and thermal conductivity, meanwhile has good strength and hardness, and further has the advantages of being resistant to heat and abrasion and high in deformation prevention capacity; the tensile strength reaches 490 MPa, the impact displacement reaches 4.6 mm, the ductility re