Substrate surface grinding device

The present invention provides a substrate surface polishing apparatus, comprising: a polishing apparatus including a plurality of polishing rollers for polishing the surface of a substrate; and a substrate support member that supports the substrate, in which a rotation axis of the polishing roller...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG SUNG-IL, HUR JUNG-HO, KOO JONG-HOI, JIN LIJUN, KIM HONGAN, BAE IN SEOB
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention provides a substrate surface polishing apparatus, comprising: a polishing apparatus including a plurality of polishing rollers for polishing the surface of a substrate; and a substrate support member that supports the substrate, in which a rotation axis of the polishing roller is disposed so as to be inclined with respect to a rotation axis of an adjacent polishing roller. 本发明提供一种基板表面研磨装置,其包括:研磨装置,其包括对基板的表面进行研磨的多个研磨辊;以及基板支撑部件,其支撑所述基板,其中,所述研磨辊的旋转轴设置为与相邻的研磨辊的旋转轴相倾斜。