Cutting method, device and system, laser, electronic equipment and storage medium

The invention provides a cutting method, device and system, a laser, electronic equipment and a storage medium. The cutting method conveniently comprises the steps that the to-be-cut position of a target object is determined; if the material type corresponding to the to-be-cut position is inconsistent with the material type of the previous cutting position, determining a pulse width parameter corresponding to the to-be-cut position; and after the laser is controlled to switch the current pulse width parameter to the pulse width parameter, the to-be-cut position is controlled to be cut. According to the cutting method provided by the embodiment of the invention, the function of switching the pulse width parameter of the laser can be realized in the continuous cutting process, the optimal pulse width parameter suitable for the cutting part is used for the cutting part, the response time is short, burrs and heat affected zones on the surface of the target object can be reduced or eliminated, and the cutting qual