Cleaning formulations

A composition useful for removing residues from a semiconductor substrate, the composition comprising, in effective cleaning amounts: about 55 to 80 wt% water; from about 0.3 to about 5.0 wt% EDTA; from about 10.0 to about 30.0% by weight of an amine compound, wherein the amine compound is selected from the group consisting of secondary amines, tertiary amines, and mixtures thereof; from about 0.1 to about 5.0 wt% of a polyfunctional organic acid; from about 0.01 to about 8.0 wt% of a source of fluoride ions; from about 0 to about 60% by weight of a water-miscible organic solvent; and from about 0 to about 15% by weight of a corrosion inhibitor. 一种可用于从半导体衬底去除残留物的组合物，所述组合物包含有效清洁量的：约55至80重量％的水；约0.3至约5.0重量％的EDTA；约10.0至约30.0重量％的胺化合物，其中所述胺化合物选自仲胺、叔胺和其混合物；约0.1至约5.0重量％的多官能有机酸；约0.01至约8.0重量％的氟离子源；约0至约60重量％的水混溶性的有机溶剂；和约0至约15重量％的腐蚀抑制剂。