Wafer processing cutting device with protective structure

The invention discloses a wafer processing cutting device with a protective structure, which comprises a wafer cutting machine body, two first sliding rails are symmetrically mounted on two sides of the top of the wafer cutting machine body, hydraulic telescopic rods are mounted on one sides of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YIN ZEAN, CHEN DIANWEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	PERFORMING OPERATIONS TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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