Wafer processing cutting device with protective structure

The invention discloses a wafer processing cutting device with a protective structure, which comprises a wafer cutting machine body, two first sliding rails are symmetrically mounted on two sides of the top of the wafer cutting machine body, hydraulic telescopic rods are mounted on one sides of the bottoms of the two first sliding rails, and the output ends of the two hydraulic telescopic rods are fixedly connected with a portal frame; according to the wafer cutting device, the cutting moving mechanism is installed, wafers of different sizes can be cut conveniently, the situation that chippings splash in the cutting process is greatly reduced through installation of the protection mechanism and the protection cover, meanwhile, a movable protection cover in the protection mechanism can move in a telescopic mode, and therefore the cutting efficiency is improved. The position of the movable protective cover can be adjusted according to actual conditions, the heat dissipation mechanism is linked with a cutting mo