Process method for removing fogging on gold surface in FPC (Flexible Printed Circuit) board processing process

The invention relates to a process method for removing fogging on a gold surface in an FPC (Flexible Printed Circuit) board processing process, which comprises the following steps of: S1, performing chemical gold: selecting a to-be-processed FPC board, and performing chemical gold on the surface of the FPC board; s2, baking: baking the FPC board subjected to the chemical gold treatment through a nitrogen oven, and pasting a shielding film on the surface of the FPC board after the baking is completed; s3, pyrography is conducted, specifically, pyrography is conducted on the surface of the FPC board after the shielding film is pasted, reinforcement is pasted on the pyrography FPC board, secondary pyrography is conducted on the surface of the FPC board again after reinforcement is pasted, and secondary reinforcement is conducted after secondary pyrography is completed; s4, pressing: pressing the FPC board subjected to secondary reinforcement; and S5, curing: curing the pressed FPC board by adopting a curing proc