Bonding driving device and flip chip bonding machine

The invention relates to a bonding driving device and a flip chip bonder, the bonding driving device comprises a support table, a first driving assembly, a rotation driving assembly and a holder, the rotation driving assembly is arranged on the support table, the first driving assembly is arranged on the rotation driving assembly, the first driving assembly comprises a connecting shaft, the connecting shaft is used for being connected with an adapter shaft, and the adapter shaft is connected with the holder. The first driving assembly can drive the bonding head to get close to or away from the substrate in the first direction. The rotary driving assembly is connected with the first driving assembly and used for driving the first driving assembly to rotate with the first direction as the axis. The retaining part is arranged on the supporting table, a via hole used for containing the adapter shaft and/or the connecting shaft is formed in the retaining part, and the retaining part can form a high-pressure fillin