High-speed 3D metal printing of semiconductor metal interconnects

A system for printing metal interconnects on a substrate includes an anode substrate. A plurality of anodes are disposed on one side of the anode substrate with a first predetermined gap between adjacent ones of the plurality of anodes. A first plurality of fluid apertures has one end between the plurality of anodes. A plurality of control devices are configured to selectively supply current to the plurality of anodes, respectively. The anode substrate is disposed within a second predetermined gap of a workpiece substrate comprising a metal seed layer. A ratio of the second predetermined gap to the first predetermined gap is in a range from 0.5: 1 to 1.5: 1. The array controller is configured to use a corresponding one of the plurality of control devices to energize a selected one of the plurality of anodes when an electrolyte solution is supplied through the first plurality of fluid apertures between the anode substrate and the workpiece substrate. 一种在衬底上打印金属互连件的系统包含阳极衬底。多个阳极被布置于所述阳极衬底的一侧上，其中在所述多个阳极的相邻者之间具有第