Semiconductor processing machine and using method thereof

A processing machine table tool includes: a chamber housing defined by a processing chamber; and a wafer chuck structure disposed within the processing chamber. The wafer chuck structure is configured to hold a wafer during a manufacturing process. The wafer chuck includes a lower portion and an upper portion disposed above the lower portion. The lower portion includes a plurality of grooves extending from a topmost surface toward a bottommost surface of the lower portion. The upper portion includes a plurality of openings that are apertures extending completely through the upper portion and directly overlying the trenches of the lower portion. A plurality of openings directly overlie each trench. Further, a cooling gas conduit is coupled to the trench of the lower portion of the wafer chuck structure, and a cooling gas source is coupled to the cooling gas conduit. 一种处理机台工具，包含：腔室壳体，由处理腔室界定；以及晶片卡盘结构，设置在处理腔室内。晶片卡盘结构配置成在制造工艺期间固持晶片。晶片卡盘包含下部部分和设置在下部部分上方的上部部分。下部部分包含从下部部分的最顶部表面朝向最底部表面延伸的多个沟槽。上部部分包含多个开口，所述开口为孔，完全延伸穿过