Low-shrinkage epoxy resin as well as preparation method and application thereof

The invention provides low-shrinkage epoxy resin as well as a preparation method and application thereof, and belongs to the technical field of high polymer material preparation. Comprising the following raw materials in parts by weight: 90-120 parts of bisphenol A epoxy resin; 45-50 parts of a curi...

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Bibliographische Detailangaben
Hauptverfasser: ZHANG SHUHUA, XU LIANGSHAN, ZHANG LIZHEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides low-shrinkage epoxy resin as well as a preparation method and application thereof, and belongs to the technical field of high polymer material preparation. Comprising the following raw materials in parts by weight: 90-120 parts of bisphenol A epoxy resin; 45-50 parts of a curing agent; 0.2 to 0.5 part of an antioxidant; and 330-360 parts of a filler. The bisphenol A epoxy resin is adopted as a raw material to prepare the epoxy resin, the shrinkage rate of a cured product is small, and the obtained epoxy resin is stable in size and high in precision; modified hexahydrophthalic anhydride is adopted as a curing agent, so that the use amount of filler is increased, the shrinkage rate of a cured product is effectively reduced, and the product is stable in size and high in precision; the antioxidant capable of being subjected to addition reaction with epoxy resin is adopted as the anti-yellowing agent, so that the anti-yellowing effect is achieved, and meanwhile, the original necessary perfor