Automatic-positioning and power-controllable in-situ laser-assisted diamond cutting device

The automatic-positioning and power-controllable in-situ laser-assisted diamond cutting device comprises an adjusting assembly and a cutting assembly, the cutting assembly is located on an emergent light path of the adjusting assembly, and the adjusting assembly and the cutting assembly are electrically connected with a processing system; the adjusting assembly comprises a fixed sliding rail, the top end of the fixed sliding rail is slidably connected with a position adjusting part, the top end of the position adjusting part is fixedly connected with a laser adjusting part, the cutting assembly is located on an emergent light path of the laser adjusting part, and the side, close to the cutting assembly, of the top end of the fixed sliding rail is fixedly connected with a PSD position sensor. The position adjusting part and the PSD position sensor are electrically connected with the processing system; the cutting assembly comprises a fixing table, the top end of the fixing table is fixedly connected with a for