Porous capillary heat dissipation structure embedded with gradient holes and manufacturing method

The invention relates to the technical field of heat dissipation, and particularly discloses an embedded gradient hole porous capillary heat dissipation structure and a manufacturing method, the embedded gradient hole porous capillary heat dissipation structure is arranged on a substrate, and the em...

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Hauptverfasser: HU JIAYU, LI YUXIAN, LEI TAO, WENG XIA, WANG YUN, XIONG CHANGWU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to the technical field of heat dissipation, and particularly discloses an embedded gradient hole porous capillary heat dissipation structure and a manufacturing method, the embedded gradient hole porous capillary heat dissipation structure is arranged on a substrate, and the embedded gradient hole porous capillary heat dissipation structure structurally comprises a gradient hole capillary structure I which is arranged on the substrate and is provided with a porous capillary structure; the first gradient hole capillary structure comprises a first transition layer and a first heat dissipation surface layer which are sequentially arranged on the substrate in a stacked mode. The aperture and porosity of the first transition layer and the first heat dissipation surface layer change in a gradient mode, the aperture decreases progressively from the transition layer to the first heat dissipation surface layer, and the porosity increases progressively from the transition layer to the first heat d