COMPONENT CARRIER AND METHOD OF MANUFACTURING A COMPONENT CARRIER

COMPONENT CARRIER AND METHOD OF MANUFACTURING A COMPONENT CARRIER

The present invention provides a component carrier (100) and a method of manufacturing a component carrier (100) wherein the component carrier (100) comprises: a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer struct...

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1. Verfasser: IFES, ABDELLAZAK
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Sprache:chi ; eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator IFES, ABDELLAZAK
description The present invention provides a component carrier (100) and a method of manufacturing a component carrier (100) wherein the component carrier (100) comprises: a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106); a component (108) embedded in the stack (102); and a heat removal body (110) configured for removing heat from the component (108) and connected to the stack (102) and preferably to the component (108), the heat removal body (110) comprising a component-side first heat removal structure (112) thermally coupled with the component (108) and a second heat removal structure (114) thermally coupled with the first heat removal structure (112) and facing away from the component (108). 本发明提供了部件承载件(100)以及制造部件承载件(100)的方法，其中，部件承载件(100)包括：叠置件(102)，该叠置件包括至少一个电传导层结构(104)和/或至少一个电绝缘层结构(106)；嵌入叠置件(102)中的部件(108)；以及热移除体(110)，该热移除体构造成用于将来自部件(108)的热移除，并且该热移除体连接至叠置件(102)以及优选地连接至部件(108)，热移除体(110)包括与部件(108)热耦合的部件侧第一热移除结构(112)以及
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a component (108) embedded in the stack (102); and a heat removal body (110) configured for removing heat from the component (108) and connected to the stack (102) and preferably to the component (108), the heat removal body (110) comprising a component-side first heat removal structure (112) thermally coupled with the component (108) and a second heat removal structure (114) thermally coupled with the first heat removal structure (112) and facing away from the component (108). 本发明提供了部件承载件(100)以及制造部件承载件(100)的方法，其中，部件承载件(100)包括：叠置件(102)，该叠置件包括至少一个电传导层结构(104)和/或至少一个电绝缘层结构(106)；嵌入叠置件(102)中的部件(108)；以及热移除体(110)，该热移除体构造成用于将来自部件(108)的热移除，并且该热移除体连接至叠置件(102)以及优选地连接至部件(108)，热移除体(110)包括与部件(108)热耦合的部件侧第一热移除结构(112)以及</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220816&amp;DB=EPODOC&amp;CC=CN&amp;NR=114916122A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220816&amp;DB=EPODOC&amp;CC=CN&amp;NR=114916122A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IFES, ABDELLAZAK</creatorcontrib><title>COMPONENT CARRIER AND METHOD OF MANUFACTURING A COMPONENT CARRIER</title><description>The present invention provides a component carrier (100) and a method of manufacturing a component carrier (100) wherein the component carrier (100) comprises: a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106); 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title COMPONENT CARRIER AND METHOD OF MANUFACTURING A COMPONENT CARRIER
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