COMPONENT CARRIER AND METHOD OF MANUFACTURING A COMPONENT CARRIER

The present invention provides a component carrier (100) and a method of manufacturing a component carrier (100) wherein the component carrier (100) comprises: a stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106); a component (108) embedded in the stack (102); and a heat removal body (110) configured for removing heat from the component (108) and connected to the stack (102) and preferably to the component (108), the heat removal body (110) comprising a component-side first heat removal structure (112) thermally coupled with the component (108) and a second heat removal structure (114) thermally coupled with the first heat removal structure (112) and facing away from the component (108). 本发明提供了部件承载件(100)以及制造部件承载件(100)的方法，其中，部件承载件(100)包括：叠置件(102)，该叠置件包括至少一个电传导层结构(104)和/或至少一个电绝缘层结构(106)；嵌入叠置件(102)中的部件(108)；以及热移除体(110)，该热移除体构造成用于将来自部件(108)的热移除，并且该热移除体连接至叠置件(102)以及优选地连接至部件(108)，热移除体(110)包括与部件(108)热耦合的部件侧第一热移除结构(112)以及