High-performance radiator for COM-E module
The invention discloses a high-performance radiator for a COM-E module, and belongs to the field of radiators, the high-performance radiator for the COM-E module comprises a substrate main body, a small copper plate is assembled on the substrate main body, fins are fixedly connected to the upper sid...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a high-performance radiator for a COM-E module, and belongs to the field of radiators, the high-performance radiator for the COM-E module comprises a substrate main body, a small copper plate is assembled on the substrate main body, fins are fixedly connected to the upper side of the substrate main body, the small copper plate and the fins are connected through five heat pipes, a fan is assembled on the outer side of the fins, and the small copper plate is fixedly connected with the fan. Fixing hardware parts are installed at the four end corners of the base plate body, a plurality of avoiding areas are formed in the base plate body, the base plate body is made of high-strength aluminum alloy, the fins are made of red copper, a top plate mechanism is further arranged on the upper side of the base plate body, and the top plate mechanism comprises an auxiliary support located on the upper side of the base plate body. An elastic support is installed in the auxiliary support, and the lower |
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