Device and method for treating substrate web
The invention relates to a device for processing a substrate web, comprising a first printing device for printing the substrate web, a cutting device for cutting the substrate web into sheets, and a sheet printing press for printing the sheets. A second printing device is provided for printing the s...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The invention relates to a device for processing a substrate web, comprising a first printing device for printing the substrate web, a cutting device for cutting the substrate web into sheets, and a sheet printing press for printing the sheets. A second printing device is provided for printing the substrate web, and the camera is directed towards the substrate web. The invention relates to a device for processing a substrate web, by means of which a method for processing a substrate web can be carried out, in which a first code is printed onto the substrate web by means of a first printing device in a first step, a second code is printed onto the substrate web by means of a second printing device in a second step, and the substrate web is cut into sheets by means of a cutting device in a third step, the first step, the second step, the third step and the fourth step are carried out on line, and the first step, the second step, the third step and the fourth step are carried out on line.
一种用于处理基材幅面的设备，其包括用于印刷基材 |
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