Micro LED transfer printing method and micro LED transfer printing device

The micro LED transfer method according to one embodiment includes the steps of: preparing a substrate on which a plurality of micro LEDs are formed; transferring the plurality of micro LEDs onto a first carrier substrate having a first adhesive substance layer; curing the first adhesive substance layer to reduce the adhesive force of the first adhesive substance layer; transferring the plurality of micro LEDs on the first carrier substrate to a second carrier substrate having a second adhesive substance layer; bonding at least a portion of the plurality of micro LEDs on the second carrier substrate to a pad on a circuit substrate using a metal bonding layer; the second carrier substrate is separated from the micro LED bonded to the circuit substrate. 根据一实施例的微型LED转印方法包括如下步骤：准备形成有多个微型发光二极管的基板；将所述多个微型LED转印到具有第一粘合物质层的第一载体基板上；固化所述第一粘合物质层而减小所述第一粘合物质层的粘合力；将所述第一载体基板上的所述多个微型LED转印到具有第二粘合物质层的第二载体基板上；利用金属接合层将所述第二载体基板上的所述多个微型LED中的至少一部分接合到电路基板上的垫；将所述第二载体基板从接合于所述电路基板上的微型LED分离。