Laser reflow soldering device and laser reflow soldering method

The laser reflow soldering apparatus according to the present invention comprises: a laser pressure head module for applying pressure to an object to be soldered, which is composed of a plurality of electronic components arranged on a substrate, by means of a light-transmitting pressure member, and applying a laser beam to the object to be soldered by means of the pressure member; and a welding object transfer module for transferring the welding object such that the welding object conveyed in from one side of the laser pressurization head module is subjected to reflow soldering treatment by the laser pressurization head module and is conveyed out toward the other side. 本发明的激光回流焊装置包括：激光加压头部模块，通过透光性加压部件对焊接对象加压并通过上述加压部件照射激光束来向基板焊接电子元件，上述焊接对象由排列在基板上的多个电子元件组成；以及焊接对象移送模块，用于移送上述焊接对象，使得从上述激光加压头部模块的一侧运入的焊接对象经过激光加压头部模块的回流焊处理并朝向另一侧运出。