Production and processing method of PTFE high-frequency metal composite circuit board

The invention belongs to the field of circuit board processing, and particularly relates to a PTFE (polytetrafluoroethylene) high-frequency metal composite circuit board production and processing method. S1, PTFE powder and PPO powder are mixed through a mixer to form a medium composite material of the substrate, the medium composite material is a layer of low-thermal-resistance high-thermal-conductivity insulating material, and the thickness of the medium composite material is 0.003-0.006 inches; s2, an insulating layer material is selected, the insulating layer material is formed by mixing PTFE pure polytetrafluoroethylene powder and PPO powder according to the optimal mixing ratio of 2: 1 through a test, the mixed PTFE pure polytetrafluoroethylene powder and PPO powder are subjected to ball milling through a ball mill for 24 hours, and a metal-based material, aluminum, copper, a stainless steel plate and the like are selected according to requirements; after PTFE powder and PPO powder are mixed and dischar