Chip module structure and method and system for chip module design

The invention relates to a chip module structure and a method and system for chip module design, and discloses a chip module comprising a radio frequency integrated circuit (RFIC) chip and a package, and a method and system for designing the module. A chip and package design is performed to allocate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HALLAM SYED B, WIELAND, MARCEL, B, KUECHENMEISTER FRANK G
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY TRANSMISSION
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