Chip module structure and method and system for chip module design

The invention relates to a chip module structure and a method and system for chip module design, and discloses a chip module comprising a radio frequency integrated circuit (RFIC) chip and a package, and a method and system for designing the module. A chip and package design is performed to allocate the RF front end (FE) between the chip and the package. The chip includes an amplifier having a first differential port, and the package includes a passive device having a second differential port connected to the first differential port, and a matching network. The second differential port is power matched to the first differential port using complex power matching based on port voltage reflection coefficients to achieve improved performance (i.e., peak power transfer over the entire bandwidth rather than only at one frequency). The power matching process may result in reduced chip power requirements, allowing device size miniaturization. Therefore, the chip and the package are iteratively and repeatedly designed