Epoxy resin curing agent, preparation method thereof and epoxy adhesive

The invention relates to the field of curing agents, in particular to an epoxy resin curing agent, a preparation method thereof and an epoxy adhesive. Comprising the following steps: mixing a sulfhydryl compound solution with a catalyst, dropwise adding a vinyl compound solution, reacting at 30-100...

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Bibliographische Detailangaben
Hauptverfasser:	XU TAO, XU CHAOPING, XIAO ZENGJUN, LI BINREN, RONG QIXIANG, CHEN LINSHENG, LONG XUJIAN, XIONG DONGLU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACYCLIC OR CARBOCYCLIC COMPOUNDS ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to the field of curing agents, in particular to an epoxy resin curing agent, a preparation method thereof and an epoxy adhesive. Comprising the following steps: mixing a sulfhydryl compound solution with a catalyst, dropwise adding a vinyl compound solution, reacting at 30-100 DEG C for 15-25 hours, and carrying out reduced pressure distillation to obtain the epoxy resin curing agent. The invention provides a novel epoxy curing agent, a vinyl compound and a sulfhydryl compound are subjected to an addition reaction, the sulfhydryl compound is subjected to chain extension, the multi-sulfhydryl epoxy curing agent is obtained, the epoxy resin curing agent with high viscosity is obtained, and meanwhile the yield of the curing agent is increased. The inventor finds that the epoxy resin curing agent prepared by using the preparation method provided by the invention can be used for rapidly curing epoxy resin, and a cured adhesive product has high cohesiveness and heat resistance and is free of p