Purification method for removing resin impurities from solar silicon wafer cutting waste residues

The invention discloses a purification method for removing resin impurities from solar silicon wafer cutting waste residues, which comprises the following steps: uniformly dispersing the solar silicon wafer cutting waste residues in an acidic aqueous solution, naturally settling or centrifugally separating a silicon material, and leaving resin particles with light specific gravity and water-soluble impurities in a water phase; carrying out filter pressing or centrifugal separation on the sediment, and cleaning; and repeating the steps for multiple times until the impurity removal rate reaches the standard. According to the method, impurities such as resin particles in the silicon cutting waste can be reduced or removed, and a high-quality silicon material is provided for preparation of nano silicon serving as a negative electrode material of a lithium ion battery. 本发明公开了一种从太阳能硅片切割废渣中去除树脂杂质的提纯方法，将太阳能硅片切割废渣均匀地分散于酸性水溶液中，让硅料自然沉降或离心分离，使比重较轻的树脂颗粒及水溶性杂质留在水相中；将沉降物压滤或离心分离，清洗；重复上述步骤多次直至杂质去除率达标。本方法可以减少或去除硅切割废料中树脂颗粒等杂质，为