Nano twin-crystal copper electroplating solution, electroplating method, nano twin-crystal copper material and application

The invention discloses a nano twin-crystal copper electroplating solution, an electroplating method, a nano twin-crystal copper material and application. The nano twin-crystal copper electroplating solution comprises copper ions, sulfuric acid, chloride ions, a nano twin-crystal copper electroplating auxiliary agent, an inhibitor and water. The nano twin crystal copper electroplating auxiliary agent comprises nickel ions, and the concentration of the nickel ions in the electroplating liquid is 0.2-1000 mM. According to the invention, a brand new electroplating solution and a microstructure regulation and control means are provided for the direct current electroplating nano twin crystal copper material; and the reduction of the nano-twin copper transition layer and the increase of the nano-twin structure proportion can be realized in the direct current electroplating crystal growth stage without depending on additional procedures or special base materials. 本发明公开了一种纳米孪晶铜电镀液、电镀方法、纳米孪晶铜材料及应用。所述纳米孪晶铜电镀液包含铜离子、硫酸、氯