Plasma thin film deposition device and processing method for irregular-shaped parts

The plasma film deposition device comprises a high-voltage electrode and a grounding electrode, the high-voltage electrode is connected with a high-voltage power supply through a high-voltage wire, and the high-voltage electrode and an organic glass tube unit form a discharge area. The high-voltage...

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Hauptverfasser: ZHOU YANGYANG, HUANG CHENGSHUO, CUI XINGLEI, WANG DIYI, ZHU XI, FANG ZHI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The plasma film deposition device comprises a high-voltage electrode and a grounding electrode, the high-voltage electrode is connected with a high-voltage power supply through a high-voltage wire, and the high-voltage electrode and an organic glass tube unit form a discharge area. The high-voltage electrode is connected with the grounding electrode through the flexible polymer long guide pipe, the grounding electrode is located at a port of the flexible polymer long guide pipe, the flexible polymer long guide pipe is taken and clamped by the mechanical arm unit, and an outlet of the flexible polymer long guide pipe is aligned with a processing part of a processed part under the control of the mechanical arm unit. Compared with the prior art, the processing efficiency of some complex hollow parts with large curvature is greatly improved, narrow gaps cannot be completely processed through an existing method, but narrow zones such as the part gaps can be perfectly processed through the method. And meanwhile, a